Master Bond‘s LED415DC90 is a one-component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition.
This no-mix system requires a post-cure with heat and adheres well to similar and dissimilar substrates. The cure rate depends upon the intensity of the light source, the thickness of the adhesive layer, and the distance from the light to the adhesive.
“Conventional light curing adhesives do not allow light penetration beyond 1 mm,” shares Rohit Ramnath, a senior product engineer with Master Bond. “LED415DC90’s key distinguishing factor is its ability to partially cure or fixture up to 6 mm deep or in cross sections under LED light at the right intensity. That enables a unique practical feature of this product — fixturing of components which are opaque.
“The mechanism in which this occurs is by allowing the light to penetrate through the adhesive from the sides and not needing light to be exposed throughout the entire areas,” adds Ramnath. “It must be noted that post-curing with heat at about 95°C for 30-60 minutes is critical for enhancing strength and overall performance.”
LED415DC90 has a thixotropic index of 5.53 at room temperature. It has an excellent physical strength profile with a tensile strength of 5,500 to 6,500 psi, a tensile modulus of 450,000 to 550,000 psi, and lap shear strength for aluminum-to-aluminum of more than 1,000 psi.
This rigid system cures with a hardness of around 85-90 Shore D and elongation of one to three percent at 75° F. The new adhesive is serviceable from -80° to +350° F, and is electrically non-conductive with a volume resistivity greater than 1014 ohm-cm.
LED415DC90 is available in EFD syringes, a half-pint, pint, and quart containers.