Master Bond‘s EP5TC-80 is a one-part, NASA low-outgassing-rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It’s formulated for bonding, sealing, and small encapsulating applications.
The new epoxy requires a cure at only 80° C for 90 minutes to two hours. To optimize performance properties a post-cure of one to two hours at 80°C is recommended.
EP5TC-80 is electrically insulating, with a volume resistivity greater than 1014 ohm-cm. It features a low thermal resistance of 6-10 x 10-6 K·m2/W and can be applied in extremely thin sections due to its ultra-fine particle filler. This high-strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000 and 27,000 psi.
Additionally, EP5TC-80 exhibits good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90-100, and an elongation of 0.5 to 1.5%. It’s serviceable over the temperature range of -50° to +150° C, and has a glass transition temperature of 110 to 115° C. Packaging is available in 3, 5, 10, and 30 cc syringes and ships in dry ice.
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