Master Bond‘s UV23FLDC-80TK is a moderate viscosity, cationic type system, offering UV-light and heat-curing mechanisms. It cures readily within 20 to 30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm.
Request a technical data sheet for UV23FLDC-80TK here.
Additionally, the adhesive can undergo a secondary heat curing for shadowed areas, typically curing in 60 to 90 minutes at 80° to 85° C. The system’s adaptability to varying depths and applications, such as encapsulation and bonding, enhances its versatility.
UV23FLDC-80TK has a viscosity of 25,000 to 50,000 cps, and is highly thixotropic, which is advantageous for applications where minimal flow is required. It has a low tensile modulus of 250 to 500 psi, and a high elongation of 90 to 100% at room temperature.
Its toughness and flexibility allow it to withstand rigorous thermal cycling, making it well-suited for applications where low stress is critical. The system features excellent electrical insulation with a volume resistivity exceeding 1014 ohm-cm.
UV23FLDC-80TK is not susceptible to oxygen inhibition. It bonds well to metals, glass, ceramics, and many plastics, including but not limited to acrylics and polycarbonates. It has a service temperature ranging from -80° to +300° F. It’s also available in a wide range of packaging options, including syringes, 1/2-pint, pint, quart, and gallon containers.
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Filed Under: Adhesives • epoxies