Elma Electronic Inc. has announced a new MicroTCA solution in a 3U MicroSlim™ design. The MicroSlim™ line is geared to maximize performance in a minimum of space.
The 19″ rackmount 3U MicroSlim™ chassis offers 12 AMC (AdvancedMC), 2 MCH (MicroTCA Carrier Hub), 1 JSM (J-TAG Switch Module), 2 PM (Power Modules) and 3 spare slots. There are also 4 HDD slots with SATA connectivity. Cooling is achieved with redundant Cooling Units in a push/pull airflow configuration. They feature 42 cubic feet per minute of airflow each with a hot-swap switch, fan fail indicator, and ergonomic handles. Thermal simulation and testing confirms the chassis offers excellent cooling performance.
The MicroSlim™ chassis accepts cards in the single module/mid size (75 mm high x 4 HP wide). The chassis configuration can be customized to allow double modules (150 mm) and compact (3 HP) or full size (6 HP) modules. The 3U enclosure is the 2nd in the line of Elma’s MicroSlim™ chassis. The 1U version released in late 2007 offers 6 AMC, 1 PM, 1 MCH and 1 JSM slots.
Other features of the 3U MicroSlim™ include a separately removable filter tray with 45 PPI NEBS grade filter and dual ESD jacks in the front of the chassis. The lead-time is 4-6 weeks.