Rogers Corporation (NYSE: ROG) Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance. COOLSPAN TECA Film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. The adhesive can be used…
Rogers – PCB West 2012 Conference & Exhibition
Rogers Corporation will be participating in the PCB West 2012 Conference & Exhibition, September 25-27, in both the technical program and the exhibition floor. Visitors to Rogers’ Booth #101 are invited to find out how halogen-free Theta® circuit materials can improve the performance of their high-speed digital circuits. These RoHS-compliant, laminate and prepreg products exhibit…