The non-halogenated EP90FR series of products from Master Bond set a new standard of flame retardancy, meeting FAR 14 CFR 25.853(a) specifications for both vertical and horizontal burn tests. This strict industry certification is often required for specialty aerospace applications such as interior panels, door frame lining, floor and door assemblies, etc. The series includes:…
Master Bond launches a toughened epoxy for dam-and-fill encapsulation
Master Bond has launched. a new adhesive, Supreme 3DM-85. This is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. The new epoxy can also be used for bonding and sealing, especially where no flow is needed since the material cures in place…
Master Bond offers thixotropic epoxy with low coefficient of thermal expansion
Master Bond EP5LTE-100 is a one-part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. The new epoxy also has a thixotropic paste consistency making it ideal for bonding, sealing and gap-filling applications. These properties are especially useful for optoelectronics or applications…
New Master Bond die-attach epoxy meets NASA low-outgassing requirements
Master Bond‘s new EP17HTDA-2 is a one-component epoxy that can be used for bonding, sealing, and die attachment. It’s not premixed and frozen and cures with heat. This dimensionally stable system features excellent mechanical properties with a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional…
This dual-curable adhesive cures rapidly with an LED light source
Master Bond‘s LED415DC90 is a one-component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. This no-mix system requires a post-cure with heat and adheres well to similar and dissimilar substrates. The cure rate depends upon the intensity of the light source, the thickness of…
How to choose an adhesive for electronic applications
Master Bond, a manufacturer of epoxy adhesives, sealants, coatings, has released a pre-recorded webinar on the considerations for choosing the ideal adhesive for electronic applications. This discussion covers not only adhesives but also coatings and potting compounds and particularly for challenging electronics. Viewers will learn how to navigate the selection process while keeping in mind…
Master Bond releases non-cytotoxic epoxy for medical devices
Master Bond‘s new EP41S-5Med is a two-part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high-temperature resistance and excellent strength properties. As an electrically insulative material, it can be used in medical electronic applications. This epoxy was tested…
Master Bond launches new electrically insulative, toughened epoxy
Master Bond‘s Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing, and coating applications. It’s capable of withstanding temperatures up to 450° F (232° C) and provides a glass-transition temperature (Tg) of 130° to 135° C. The material meets NASA low-outgassing standards and is recommended for applications that require vacuum compatibility.…
New electrically isolating epoxy offers high-heat transfer capability
Master Bond‘s EP5TC-80 is a one-part, NASA low-outgassing-rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It’s formulated for bonding, sealing, and small encapsulating applications.…
Master Bond’s non-conductive silicone meets NASA low-outgassing specifications
Master Bond‘s MasterSil 323AO-LO is a two-component silicone elastomer with a self-priming feature, designed for bonding, sealing, and gap-filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, opto-electronic, and specialty OEM industries. This system has a thermal conductivity of 1.15-1.30 W/(m•K).…