by Walter Brenner, PhD, Founder, Master Bond Inc. Structural polymers offer distinct advantages over traditional fastening methods. Here, we explore the cornerstones of successful structural bonding. Structural bonding is defined as the process of joining parts together using an adhesive as opposed to conventional mechanical fasteners or assembly methods such as soldering, brazing or welding.…
Epoxy adhesive has ultra low thermal resistance, meets NASA low outgassing specifications
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)].…
Enhance Electronic Performance with Epoxy Compounds
by Venkat Nandivada, Manager, Technical Sales, Master Bond Offering a nearly limitless assortment of end properties, epoxy systems enable higher density semiconductor electronics and economical, as well as enhanced reliability, while improving manufacturing efficiencies. Today’s high performance electronic circuits that are designed into compact assemblies must meet a host of engineering requirements to ensure the…
Dimensionally Stable Epoxy Based UV Curable System with High Temperature Resistance
Master Bond UV15 is widely used for a variety of bonding, coating and sealing applications in the optical, electronic and optoelectronic industries. This epoxy based UV curable system is 100% reactive and does not contain any solvents or other volatiles. It is also completely free of any oxygen inhibition. Master Bond Electrically Insulative Adhesives Master Bond…