The EP30M3LV is a low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. It cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various cross section thicknesses.
It has a volume resistivity of 2×1015 ohm cm at 25° C. It has a convenient 2 to 1 mix ratio by weight and an advantageously low mixed viscosity of 2,000-3,000 cps. Adhesion to similar and dissimilar substrates is excellent. Cured castings can resist exposure to various chemicals and thermal cycling. It has a service operating temperature range of -60 to 250° F. It has a flexural strength of 14,000 psi and a tensile strength of >8,000 psi.
Master Bond Inc.