NextFlex, America’s flexible hybrid electronics (FHE) manufacturing Institute, has announced $17 million in funding (including $8.7M in cost-share contribution from participants) for 18 new projects as part of its Project Call 6.0.
The aim is to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
Project Call 6.0’s awarded projects represent a diverse and innovative set of companies and universities that together are focused on maturing the industry’s capabilities while leveraging the strong foundation.
Included in this latest round of funded projects are applications that help to move the manufacturing industry closer to volume manufacturing and commercialization, including two awards related to adhesive development for electronic applications.
Industries covered in the Project Call entail additively manufactured high-temperature conductors for hypersonics, sensors and communication systems for unmanned aerial systems, wireless monitoring devices for safer human-robot interfacing on the factory floor, and software tools that enable reliability modeling and simplify manufacturing.
The two adhesive-related awards are to:
- Development led by SunRay Scientific to demonstrate the reliability and scalability of a magnetically aligned anisotropic conductive adhesive for component attach in aerospace and automotive lighting applications
- Development led by Auburn University for evaluation of the reliability of electrically conductive adhesives, magnetic-oriented anisotropic conductive adhesives, and low-temperature solders for FHE in harsh environments
”This latest round of projects focus broadly on critical FHE manufacturing developments that have been prioritized in the NextFlex FHE Manufacturing Roadmaps,” said Malcolm Thompson, PhD, executive director, NextFlex. “These projects will develop groundbreaking capabilities that will transition to industrial practice and benefit U.S. manufacturing.”
For more information and the full list of those awarded funding, click here.
The topics for Project Call 7.0 are also now available here.