Master Bond‘s new EP4S-80 is a one-component, silver-filled epoxy that meets NASA’s low-outgassing requirements. It has an unlimited working life at room temperature and a moderate heat-cure requirement of 80° C.
With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow that makes it easy to brush on an area, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as well as gap-filling and encapsulating.
EP4S-80 features excellent mechanical properties with a tensile modulus of 500,000-600,000 psi and a compressive strength of 22,000-24,000 psi at 25° C. This electrically conductive system offers a volume resistivity of 0.02-0.06 ohm-cm and a thermal conductivity of 1.30-1.44 W/(m•K).
Upon curing, EP4S-80 offers low shrinkage, excellent dimensional stability, and a glass-transition temperature of 130-135° C. Serviceable over the temperature range of -60° to +150° C [-75° to +300° F], this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials, and many plastics.