Master Bond‘s new EP40TC is a two-part epoxy system, designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required.
With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler, making it ideal for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 1015 ohm-cm.
“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness,” explained Rohit Ramnath, senior product engineer. “It has a high strength profile with a tensile lap shear strength of 2,300-2,500 psi, an elongation of 60-70%, and a tensile modulus of 5,000-15,000 psi.”
Serviceable from -100° to +300° F, this toughened system resists thermal cycling, vibration and shock. EP40TC exhibits a high peel strength of 40-60 pli and Shore D hardness of 70-80 at 75° F.
It features a convenient 1:1 mix ratio, and cures in two to three days at room temperature or faster with the addition of heat. This compound adheres well to a variety of substrates such as metals, composites, glass, and many plastics. EP40TC is available in standard packaging, as well as premixed and frozen syringes.
“Also, it meets NASA low-outgassing specifications which is a prerequisite for many aerospace, electronic, and optical applications,” added Ramnath.