New Master Bond die-attach epoxy meets NASA low-outgassing requirements

 

Master Bond‘s new EP17HTDA-2 is a one-component epoxy that can be used for bonding, sealing, and die attachment. It’s not premixed and frozen and cures with heat.

This dimensionally stable system features excellent mechanical properties with a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively.

EP17HTDA-2 has exceptional temperature resistance with a service temperature range of -80° to +600° F (-62° to +316° C) and a T_g of 185° to 190° C. The compound has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)], a low coefficient of thermal expansion, and is electrically insulative with a volume resistivity greater than 10¹⁵ ohm-cm.

As a one-part system, EP17HTDA-2 does not require any mixing and is curable in the temperature range of 300° to 350° F for about four to five hours. To optimize properties, a post-cure of two to three hours at 400° F is recommended.

It bonds well to a variety of substrates, such as metals, ceramics, plastics and composites. Upon curing, it delivers a tensile modulus exceeding 1,100,000 psi and a die shear strength of 20 to 23 kg-f at room temperature (2 x 2 mm [80 x 80 mil]). It also has minimal shrinkage upon curing.

While EP17HTDA-2 is well suited for electronic and related applications, it can also be used in vacuum situations as it passes NASA low outgassing testing. It is a thixotropic paste, yet is available in 10 cc and 30 cc syringes for automated dispensing, and has a shelf life of three to six months when stored at 40° to 50° F.