Dymax, a manufacturer of rapid light-curing materials and equipment, has developed a light and/or heat-curable cationic epoxy for active alignment of camera modules, optical components, light detection & ranging (LiDAR), and other advanced driver-assistance system (ADAS) assemblies used in automotive applications.
The new Dymax 9803 offers very low volumetric shrinkage, high Tg, and low coefficient thermal expansion (CTE). It was specifically developed to meet rigorous active alignment requirements.
Optical components, lenses in cameras, CCD chips, and complex optical devices need to be positioned economically and efficiently. Active alignment is the primary solution for making high-precision image systems manufacturable and feasible in products, where devices need to align down to micron accuracy.
The flexibility to cure fast with a broad-spectrum UV light, LED light, or low-temperature heat accommodates several different application needs. To meet these goals, the next-generation cationic epoxy, 9803, has improved 85° C / 85% RH resistance, exhibiting less overall movement through thermal excursions. It also features a higher viscosity and thixotropy to maintain bead shape when dispensed.
In addition, the material can be refrigerated and shipped/stored between 1-5° C — and not frozen. Dymax 9803 meets NASA ASTM E595 low-outgassing specifications making this solution ideal for critical optical components.
All of these characteristics help manufacturers improve time-to-market, reduce scrap costs, and enhance overall image quality. The typical camera module applications include bonding the lens barrel to holder, lens bonding, and bonding the holder to printed circuit boards (PCBs).