Master Bond, a manufacturer of epoxy adhesives, sealants, and coatings, has launched an informative, interactive infographic of adhesives for electronic applications. Simply click on one of the icons (linked masterbond.com/industries/interactive-summary-adhesives-electronic-applications) to learn more about the different types of adhesives used for an application.
The infographic includes information on the following:
Potting and encapsulation compounds: Featuring outstanding electrical insulation properties, these systems are used in low, medium and high-voltage applications and maintain superior thermal stability and chemical resistance.
These systems offer protection against corrosion and crack-resistance to ensure high performance.
Die-attach formulations: With die shear strength ranging from 20-42 kg-f, these systems are available in electrically insulative or electrically conductive formulations. They meet the requirements for the many critical electronic devices manufactured for the medical, military, aerospace and other industries.
These die attach adhesives are also available in one component heat curing formulations and as B-staged epoxy films.
Spin coating UV systems: These UV-curable systems are ideal for high-precision optical component manufacturing applications. These one part compounds provide a thin-film coating that allows the component to retain its original physical, transmission and reflective properties.
Custom formulations can be engineered to protect components against harsh chemicals and abrasion.
Underfill compounds: This line of epoxy underfills offer superior stress reduction on solder joints, as well as protection from moisture. They’re available in both high and low viscosities as well as in snap curing and re-workable formulations.
Glob top formulations: Ideal for the encapsulation of semiconductor chips and wire bonds, these glob top systems offer resistance from moisture, chemicals, and contaminants. These thixotropic compounds offer low stress, low shrinkage upon curing and fast cure speeds.
Heat-sink attachment: Compounds for heat sink attachment include one and two component epoxy and silicone systems featuring high thermal conductivity for heat dissipation. These materials contain special alumina or aluminum nitride fillers to improve device reliability and help prevent overheating or premature component failure.