Master Bond EP4EN-80 is a NASA-approved, low-outgassing epoxy. It can cure at temperatures as low as 80° C, which is unlike conventional one component heat-curing systems. It also features a quick cure profile at 65° C for 90 minutes plus 30 minutes at 80° to 85° C.
The epoxy system requires no mixing prior to use, has a very low viscosity (of 600-1,800 cps) and contains zero solvents. Free-flowing EP4EN-80 is suitable for bonding, as well as small potting and encapsulations — up to about one-quarter-inch thick in some applications.
Due to its ultra-fine particle size filler material, this system offers unique gap-filling and heat-transfer capabilities. It has a thermal conductivity value of 0.75-0.85 W/(m•K) and an electrical insulation with a volume resistivity of more than 1014 ohm-cm at room temperature. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10 to 15 microns.
EP4EN-80 provides notable strength properties including a compressive strength of 24,000 to 26,000 psi and an ultra-high tensile modulus of 1,200,000 to 1,400,000 psi at room temperature. It is serviceable over the temperature range of -50° to +150° C.
EP4EN-80 bonds well to a variety of substrates. It effectively resists waters, oils and fuels. This compound is gray in color and is RoHS compliant. Packaging is available in ½ pint, pint, quart and gallon sizes.
Thermally conductive epoxies
Master Bond EP4EN-80 is a one part, non-premixed and frozen epoxy system used for bonding and small encapsulation applications. This electrically insulative system features an ultra fine particle size filler material contributing to its enhanced thermal resistance properties. It can cure at temperatures as low as 80° C unlike conventional one part, heat curing systems.