Master Bond EP5G-80 is a new, one-component, low-outgassing NASA-rated epoxy, with a moderate temperature cure requirement of 80° C for four hours.

This graphite filled compound has an unlimited working life at room temperature and does not come premixed or frozen. It offers electrical conductivity with a volume resistivity of 5 to 15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature.

“EP5G-80 is a specialty non-metallic system designed for heat-sensitive electronic applications where high levels of conductivity are desired. Its key feature is that it does not need elevated heat to fully cure,” explains Rohit Ramnath, Master Bond senior product engineer. “Unlike other graphite filled adhesives, EP5G-80 is a smooth thixotropic paste and can be easily dispensed manually or using automated systems.”

For a conductive system, EP5G-80 provides an especially high Tg of around 130° to 140° C, and a tensile modulus that exceeds 1,000,000 psi at room temperature.

It’s serviceable over a temperature range of -50° to +175° C and offers a low coefficient of thermal expansion. This formulation features a good lubricity and can be employed for static dissipation and EMI/RFI shielding applications. It’s black in color and RoHS compliant. Packaging is available in syringes, jar, and pint containers.