Master Bond’s LED405FL3 is a solvent-free, low-viscosity system that can be used for small potting and encapsulation applications.
Master Bond‘s new LED405FL3 is a flexible, one-component, LED-curing adhesive system.
With an excellent optical clarity and a refractive index of 1.51, its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion.
The new adhesive also uses a fluorescent dye for detection purposes, which enables easy visual inspection.
This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source and without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds.
However, the rate of cure depends on the intensity of the light source, the thickness of the adhesive layer, and the distance from the light to the adhesive. The LED405FL3 is serviceable from -100° to +250° F. It cures with a hardness of around 5-15 Shore D at room temperature.
Additional performance properties include electrical insulation, as well as resistance to thermal cycling, shock, and vibration.
Master Bond’s LED405FL3 is a low-viscosity system that may be used for small potting and encapsulation applications, assuming that there are no shadows or concealed areas. This solvent-free, RoHS compliant compound is available in syringes, half-pint, pint, and quart containers.
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