The new Low Shrink OP-81-LS adhesive does not react until exposed to light, so manufacturers have time to accurately align electronic parts before assembly and cure.
Dymax, a manufacturer of light-curing materials and curing devices, recently launched an innovative, Low Shrink OP-81-LS epoxy-based adhesive. With UV or visible light, this adhesive cures within seconds with almost zero shrinkage, enabling fast and precise assembly of optical components.
In addition to very low volume shrinkage during curing, Dymax Low Shrink OP-81-LS is also characterized by a low-coefficient of thermal expansion, which leads to high stability in the event of temperature fluctuations. It also passes the vacuum stability and outgassing test according to ASTM E595 and is ideal for positioning and bonding lenses, prisms, fibers, and other optical components.
Since the material used only hardens when it is exposed, manufacturers can precisely position the sensitive components during assembly before they are glued.
The special feature: Dymax Low Shrink OP-81-LS has not only its light-curing properties but also a heat-curing mechanism. It can be used where only heat curing is possible (80 – 85° C) or where shadow areas make secondary heat curing necessary. The material is solvent-free and one-component.
Dymax OP-81-LS bonds several different types of materials, such as polycarbonate, glass, acrylic, and metal, and is ideal for use in entertainment electronics.
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