Dymax, manufacturer of rapid light-curing materials and equipment, has developed a light and/or heat-curable cationic epoxy for active alignment of camera modules, optical components, light detection and ranging (LiDAR), and other advanced driver-assistance systems (ADAS) assemblies used in automotive applications.
The newly developed adhesive meets all critical specifications of NASA’s ASTM E595 standard for low outgassing.
Optical components, lenses in cameras, CCD chips, or complex optical devices need to be positioned economically and efficiently.
Active alignment is the primary solution for making high-precision image systems manufacturable and feasible in final products, where devices need to align down to micron accuracy.
The new 9803 was developed to meet these rigorous active alignment requirements, offering low volumetric shrinkage, high Tg, and low coefficient thermal expansion.
The flexibility to cure fast with broad spectrum UV light, LED light, or low-temperature heat accommodates a variety of application needs. As the next-generation cationic epoxy, Dymax 9803 and has an improved 85° C / 85% RH resistance, exhibiting less overall movement through thermal excursions and featuring higher viscosity and thixotropy to maintain bead shape upon dispense.
Additionally, the material can be refrigerated and shipped / stored at 1-5° C, and not frozen. Dymax 9803 meets NASA ASTM E595 low-outgassing specifications making this solution ideal for critical optical components. All these characteristics help manufacturers improve time-to-market, reduce scrap costs, and enhance overall image quality.
Typical camera module applications include bonding the lens barrel to holder, lens bonding, and bonding the holder to printed circuit boards (PCBs).
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