AI Technology, Inc. (AIT) introduces COOL-PAD™ CPR7154, a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C. COOL-PAD™ CPR7154 is optimized to accommodate large areas with different heights and gaps of less than 3-mil…
Flexible Loctite® Instant Adhesives Deliver High-Strength Bonds in Seconds
Henkel Corporation has developed two new highly flexible instant adhesives, Loctite® 4902 and Loctite® 4903, that offer elongations up to 155% and provide high-strength bonds in seconds. Both cyanoacrylate adhesives bond reliably to plastics, rubbers, metals and other substrates and offer ISO 10993 biocompatibility for use on disposable medical devices. These one-part, low-viscosity instant adhesives…
How to Secure Fasteners and Strengthen Interference Fits
By Doug Lescarbeau, Anaerobic Technology Manager, and Tina Adams, OEM Market Manager, Henkel Corporation Retaining compounds offer a number of benefits in fastening applications, including reducing weight, lowering cost and assembly time, and even reducing some dimensional precision requirements. Here’s a closer look at when and how you can use retaining compounds. Ancillary benefits of…
Rogers Corp Launches Coolspan Thermally & Electrically Conductive Adhesive Film
Rogers Corporation (NYSE: ROG) Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance. COOLSPAN TECA Film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. The adhesive can be used…
New Loctite® Structural Adhesive and NVH Selector Guide
Henkel Corporation has introduced its new Loctite® Structural Adhesives and NVH Selector Guide. This 30-page brochure is designed to educate readers about the performance of structural adhesives in demanding, high-stress applications, and to communicate their ability to reduce noise, vibration and harshness. Engineered to eliminate or greatly reduce fasteners and welds from an assembly, structural…
Henkel Retaining Compound Design Guide
Henkel Corporation has created the Loctite® Retaining Compound Design Guide, a new 20-page brochure available in print and online that provides detailed information on anaerobic retaining adhesive technology and its engineering and cost benefits, real world applications and product and equipment options. Loctite® anaerobic retaining compounds are adhesives used to secure bearings, bushings, gears and…
Flexible Epoxy System Features Electrical and Thermal Conductivity
Formulated with a silver coated nickel filler, Master Bond EP79FL is a two part, electrically conductive epoxy for bonding, sealing and coating applications. It has low volume resistivity of less than 0.005 ohm-cm and is suitable for a variety of uses in the electronic, aerospace, computer, semiconductor and electro-optic industries. In addition to its electrical…
Increasing the Strength and Reliability of Press Fits
Live webinar was recorded on November 14, 2013. Retaining compounds increase the strength and reliability of traditional press and shrink fits. Retaining compounds improve the distribution of stress, which increases maximum load transmission and performance. They create a physical barrier that eliminates fretting, oxidation and galvanic corrosion, which increase service life. Recent chemical advances in…
Master Bond’s New Catalog on Adhesives, Sealants and Coatings
New, easy to read, 32 page catalog offers performance and processing data on Master Bonds extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications. Convenient, efficient and reliable packaging options are also reviewed.…
Non-Drip Two Component Epoxy Meets FDA
Featuring a thick paste consistency, Master Bond EP21NDFG bonds well to a variety of substrates including metals, composites, glass, ceramics and many types of rubbers and plastics. Unlike many high viscosity systems, EP21NDFG is truly non-drip and will not run or sag, even when applied to vertical surfaces. It produces high strength, durable bonds that…