Chandler, AZ – Rogers Corporation (NYSE:ROG) showcases a number of its high-performance and low-cost laminate materials for commercial and military applications at the upcoming PCB West 2009 this September 15-16 in Santa Clara, CA (Booth #36) and at the IPC Midwest 2009 Show this September 23-24 in Schaumburg, IL (Booth #502). At both shows, Rogers…
UV Curable Nanosilica Filled Epoxy
The UV22 is a nanosilica reinforced UV curable epoxy system. The nano-sized filler (<50 nm) gives the cured system abrasion resistance, optical clarity, low shrinkage and physical strength properties at a viscosity of 4,000 cps. The tensile strength of the cured epoxy is greater than 4,600 psi and its tensile modulus is greater than 500,000…
Thermal Adhesive for Optimized Heat Dissipation
Hackensack, NJ – Master Bond's EP30BN is a two part boron nitride epoxy adhesive offering improved thermal management of heat generating components. EP30BN is a medium viscosity epoxy system with good flow characteristics, making it an ideal thermally conductive adhesive for bonding, sealing and potting applications. Featuring remarkably high thermal conductivity and excellent electrical insulation…
LoPro™ Laminates from Rogers Corp.
Chandler, AZ — The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. The specially formulated RO4730 LoPro thermoset resin system incorporates a…
UV Cure Adhesive from Master Bond
Hackensack, NJ – Master Bond adds a significant strength advantage to a new UV adhesive compound combining high strength bonds with the well established benefits of UV cure namely; high productivity, improved performance and environmental compliance. Master Bond UV10TK40 is a modified epoxy adhesive offering a unique tensile strength of 8300 psi and a shore…
What will communication devices look like in 2033?
Twenty-five years after the creation of the cell phone, designers at Motorola imagined what cell phones might look like in another twenty five years. The Consumer Xperience Design (CXD) team created a portfolio of sketches that look beyond what is possible today and imagine the possibilities of the future. In 2033, the “cell phone” could…
Rigid, Room Temperature Curing Thermal Conductive Epoxy
Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and electrical insulation properties. It has a service operating temperature range of 4K to 400‚°F. It also has a low thermal expansion coefficient. It is NASA qualified for low outgassing applications and is suitable for use in vacuum environments. It is durable and possesses high physical…
Plastic Adhesive Etches Away at Challenging Substrates
Hackensack, NJ – Master Bond MB514 polypropylene adhesive etches away at the bonding challenges presented by non-polar and low energy polyolefin surfaces. Typically, a pretreatment stage, which may include flame treatment, etching or roughening, is required before being able to bond polyolefin substrates. Specially formulated to eliminate this time consuming stage, the MB514 polyolefin based…
Rogers Corporation Introduces Interactive PORON® Gap Filling Tool
Rogers, CT — Rogers Corporation has introduced a unique online, interactive PORON® Gap Filling Tool to help designers select the best PORON Urethane to meet their specific application needs. The new PORON Gap Filling Tool is available to them via web access at all times, no matter where they are located. This new tool is…
Master Bond’s New MS151 Optical Adhesive
Hackensack, NJ. – Master Bond’s new MS151 optical adhesive has been specially formulated for optimal optical bonding. It is a two-part silicone adhesive with silicone‚’s inherent temperature resistance and flexibility, a refractive index of 1.43 and superb optical clarity. Its low viscosity assures complete fill-in around complicated contours even in very complex configurations. These key…