By Ronald A. Miller, MS Underfill applications use adhesive compounds to fill the gap between a microchip package and the printed circuit board (PCB). This is necessary because new types of chip packages, such as ball grid array (BGA) and chip-scale packages (CSP), are surface-mounted — meaning solder balls attach the bottom surface of the…
New Grip Tape gives tools and devices a non-slip surface
Dropped objects are a concern at any job site. Now it’s possible to avoid the accidental slips or drops of a cell phone, tablet, and other tools or devices, thanks to new Grip Tape from CatTongue Grips. The company has taken the power of its “GRIPTION” product, typically used for cell phones, and transformed it…
New thermally conductive potting compound resists high temperatures
Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing, and potting applications. Featuring a high glass transition temperature of 200 to 210° C, it resists temperatures up to 550° F. This system exhibits an element of toughness, and is not as stiff as conventional epoxies that withstand extreme temperatures.…
Which adhesives are thermally conductive?
By Ronald A. Miller, MS Adhesives are made from organic polymers and, as such, are inherently thermal and electrical insulators. The thermal conductivity of polymers is typically between 0.1 and 0.5 W/m-K (watts per meter kelvin). In comparison, steel has a thermal conductivity of about 40 W/m-K and copper is about 400 W/m-K, when measured…
Nippon Paint Marine adds to its NOA range of self-indicating epoxy coatings
Nippon Paint Marine has added to its Nippon Optimized and Advanced (NOA) range of self-indicating epoxy coatings with a new system developed to protect chemical and product carrier tanks from corrosion and cargo contamination. NOA PC 700, a phenolic and novolac-based epoxy, is resistant to a wide range of chemicals, solvents, and petroleum products —…
Master Bond’s high Tg, low-viscosity epoxy meets NASA specifications
Master Bond Supreme 112 is a new two part epoxy for bonding, sealing, potting, and impregnation applications. It is a heat-curable system with a very low viscosity of 50 to 200 cps and a long open time of two to three days at room temperature for a 100 gram batch. Supreme 112 features a high,…
Dow showcased its new EV and battery materials at The Battery Show
Dow Performance Silicones, a global provider of silicones and silicon-based technology, showcased new materials and capabilities for electric vehicle (EV) and battery pack designers at last week’s The Battery Show North America 2019. Specifically, Dow is featured its newest adhesion and conductive materials innovations: DOWSIL EA-4700 CV Adhesive and DOWSIL EC-6601 Electrically Conductive Adhesive. Other industry-leading Dow…
Which adhesives are biocompatible?
By Julie Miller Exceptional care is taken in choosing biocompatible adhesives — a category of adhesive products that are considered safe to use on or within the human body. These specialty adhesives are biologically inert, which means they produce no toxic response or interaction when in contact with human tissue or bodily fluids. Biocompatible adhesives…
Mark your calendars: 62nd annual European adhesives conference this October
The European Adhesive Tape Association (Afera) announced the launch of its 62nd Annual Conference at the Pestana Palace Hotel in Lisbon on October 9 to 11, 2019. Themed “Making the Tape Business Future-Proof,” the event will cover the industry workforce, related business models, supply chains, sales channels, technology, product development, and the application process. Conference…
Pliogrip structural adhesives to be highlighted at CAMX 2019
Ashland’s solvers will showcase truck and transportation components used for tailgating and other applications at the Composites and Advanced Materials Expo (CAMX) in Anaheim, Calif., on September 23-26, in booth H42. Ashland’s Pliogrip structural adhesives have been specified for use in bonding and the assembly of mix material joining and virtually any application that requires…